i.MX 8M Plus – ultra energiesparsames Computer-on-Module
i.MX 8M Plus – ultra energiesparsames Computer-on-Module
i.MX 8M Plus – ultra energiesparsames Computer-on-Module
i.MX 8M Plus – ultra energiesparsames Computer-on-Module
i.MX 8M Plus – ultra energiesparsames Computer-on-Module
i.MX 8M Plus – ultra energiesparsames Computer-on-Module

i.MX 8M Plus and 8X Lite

The i.MX 8 module is available in two variants. Thanks to the integrated neural processing unit, optimal conditions for AI and ML applications are given. In addition, the module is specially optimized for IoT applications.

Key Features

  • Freescale i.MX 8 (Dual Core, Quad Core,
    1.2 GHz – 1.8 GHz)
  • Up to 8 GB DDR4 Memory
  • On-Board 10/100/1000 Mbit LAN
  • Variety of interfaces,
    e.g. 3× CAN/ CAN FD, 2× USB 2.0, …
  • Extended temperature range
  • Evaluation Board on-demand 

Description

Scalable performance and compact form factor
The i.MX 8 board from Sontheim is based on a 314-pin MXM 3.0 connector with standard dimensions of 82 mm × 50 mm. This creates extremely compact, durable and cost-effective development options for mobile embedded handheld systems as well as small portable, stationary and in-vehicle devices that can be used in a wide range of application areas. The i.MX 8 is available in two variants. The i.MX 8M Plus variant for high performance applications, optimized for AI and ML applications and the i.MX 8X Lite variant for high performance telemetry and industrial applications. The i.MX 8X Lite variant has been specially optimized and developed for the Sontheim telemetry series COMhawk® xt.
 

Designed for commercial and industrial temperature range
In addition to the normal temperature range, the i.MX 8 board is also designed for the extended industrial temperature range of –40 °C to +105 °C – the i.MX 8X Lite variant even up to +125°C (AEC-Q100 Grade 2 device). This opens up a wide range of applications in the automotive sector, in automation, in medical technology and in other working environments that do not correspond to the commercial temperature range and involve harsh environmental conditions. In addition, an evaluation board is already available on request.

Optimized for machine learning and AI applications
The i.MX 8 board from Sontheim features an integrated neural processing unit (NPU) that delivers up to 2.3 TOPS (Tera Operations Per Second). This gives the board a processor that is used exclusively for machine learning and enables compute-intensive AI applications. As a result, the ML/KI application no longer needs to be moved to the cloud, but can run directly on the i.MX 8 processor – personal user data is also better protected as a result. Applications such as the recognition of multiple complex neural networks, human poses and emotions, or the monitoring of multiple objects are thus possible.

 

Overview of the target applications
Industrial:
Control systems, architectures with time-critical networking, Ethernet or CAN networks, HMIs and IPCs, robot controllers, printing systems, industrial handheld devices, intelligent industrial cameras and much more.

Automotive:
High-performance telemetry and vehicle gateways, camera systems, vehicle interfaces (VCIs), ECUs, data loggers with analysis (AI), joysticks, displays and much more.

Technical Data

Hardwarei.MX8 M Plusi.MX8 X Lite
CPUFreescale i.MX 8
Quad Core ARM Cortex-A53 1.8 GHz
Freescale i.MX 8
Dual Core ARM Cortex-A35 1.2 GHz
MCUFreescale Cortex-M7 800 MHzFreescale Cortex-M4F 170 MHz
RAMup to 8 GB 132-bit DDR4up to 1 GB 16-bit DDR4
GPUGC7000UL (2 shaders),
OpenGL ES
1.1/2.0/3.0/3.1, OpenVG
1.1, Vulkan, OpenCL 1.2; GC520L (2D)
NAND Flashup to 64 GB eMMC (on-module)up to 8 GB eMMC (on-module)
SecurityCAAM, RDC, Trust ZoneTrust Zone
KI/AINeural Processing Unit 2.3 TOPS
Camera2× MIPI CSI
(4-lanes each)
2× ISP up to 12 MP resolution
DisplayHDMI 2.0a Tx, MIPI DSI (4-lanes)
LVDS (4/8-lanes)
1× Parallel Display
Video Decode
Video Encode
1080p60 HEVC, H.264, VP9, VP8
1080p60 H.265, H.264
Audio18× I2S TDM (32 b @ 384 kHz), ASRC, 8-ch. PDM
DMIC input, eARC
Schnittstellen2× GbE (1× TSN),
2× CAN/CAN FD
3× SD/eMMC, Raw NAND
2× USB 3.0/ 2.0
5× UART, 6× I²C, 3× SPI, 1× PCIe 3.0
2× GbE (1× TSN),
3× CAN/CAN FD
3× SD/eMMC, Raw NAND
2× USB 2.0
4× UART, 3× I²C, 3× SPI, 1× PCIe 3.0
PackageLFBGA-548BGA-388
Operating System SupportLinuxLinux
Operating Temperature0 °C up to +95 °C,
extended range: −40 °C up to +105 °C
−40 °C up to +105 °C,
extended range: −40 °C up to +125 °C
DimensionsSMARC Standard: 82 mm × 50 mmSMARC Standard: 82 mm × 50 mm

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